ANSYS Products 17.1.0 | 7.6 Gb
ANSYS, Inc. has released update of its leading engineering simulation solution, ANSYS 17.0, is offers advanced functionality enabling engineers to rapidly innovate new products.
Engineers across disciplines - from structures to fluids to electromagnetics to systems - will realize step-change improvements in the way they develop products using the newly released ANSYS 17.0. This next generation of ANSYS industry-leading engineering simulation solutions set the scene for the next quantum leaps in product development, enabling unprecedented advancements across an array of industry initiatives from smart devices to autonomous vehicles to more energy-efficient machines. The most feature-rich release in the company's 45-year history, available today, delivers 10x improvements to product development productivity, insight and performance.
Simulation has been identified as one of the key pillars of the next industrial revolution, known as Industry 4.0. With the advent of the Internet of Things all products are getting smarter, new advanced materials are enabling lighter, stronger and more sustainable designs, and additive manufacturing enables users to 3-D print anything they can imagine. Unlocking the power of these trends is impossible without simulation tools' ability to virtually explore these vastly increased options to arrive at the winning designs of tomorrow.
ANSYS 17.1 offers significantly more capabilities in its easy-to-use and intuitive simulation environment for design engineers, ANSYS AIM. In addition to new structural shells for shell modeling, remote displacements, and frictionless supports for mechanical modeling and improved fluid flow simulation capabilities, ANSYS AIM 17.1 provides product designers with guided workflows and models for magnetostatics and coupled magnetic-thermal-structural analysis to rapidly simulate today's most innovative electromechanical products. Calculate magnetic flux density, magnetic field intensity, current density, Ohmic loss, magnetic force, torque and inductance using insulating, terminal and winding boundary conditions to understand the electromagnetic behavior of your device.
Take the simulation one step further and understand how the electromagnetic generated heat impacts temperature and, hence, the structural integrity of the device in light of thermal effects.
New polymer extrusion simulation capabilities in ANSYS AIM allow designers to identify manufacturing issues and reduce tooling lead time via the simulation of various aspects of the deformation of molten plastic pushed through a die opening. A guided workflow for polymer extrusion leads product engineers as they simulate flow within the die, predict the extrudate shape for a die, or predict the required die shape for a desired extrudate shape.
ANSYS AIM is already easy to customize and deploy across an engineering organization to facilitate accurate and repeatable simulation methods that enforce best practices. Release 17.1 boosts the flexibility of customization and automation with the introduction of multi-step custom templates that help further expand the value of simulation beyond analysts and into the early stages of product design where the majority of product costs are decided. Multi-step templates let method group and engineering managers create a series of custom panels and steps to load geometry, assign material properties, set boundary and initial conditions, solve the simulation, and analyze results to guide their design engineering teams through company and product-specific simulations that limit options, define the simulation parameter space and enforce best practices.
Release 17.1 also extends the Mechanical Enterprise license to include AIM. The new shared license capability provides Mechanical Enterprise customers with an easy-to-use entry point for additional physics and multiphysics simulations, and allows Enterprise customers to leverage AIM's customization capabilities to develop custom applications to automate simulation workflows.
- ANSYS171_DVD_WINX64.iso (Original ISO's Disk1 and Disk2 contains duplicate files. If you combine two ISO in one you get a common drive to 1500 Mb smaller than two ISO)
- ANSYS.Products.171.Electronics.embedded.unlock.rar (Electronics embedded in ANSYS Product 17.1 has its own licensing and limitation in functionality compared with ANSYS EM 17.1 standalone version.. here is release to unlock ANSYS Product 17.1 Electronics embedded, but I repeat: its functionality is limited compared with standalone Ansys Electromagnetics Suite 17.1 (by SSQ)
About ANSYS, Inc.
ANSYS is the global leader in engineering simulation. We bring clarity and insight to our customer's most complex design challenges through the broadest portfolio of fast, accurate and reliable simulation tools. Our technology enables organizations in all industries to imagine high-quality, innovative product designs that are sustainable and have an accelerated time to market. Founded in 1970, ANSYS employs almost 3000 professionals, more than 700 of them with PhDs in engineering fields such as finite element analysis, computational fluid dynamics, electronics and electromagnetics, embedded software, system simulation and design optimization. Headquartered south of Pittsburgh, U.S.A., ANSYS has more than 75 strategic sales and development locations throughout the world with a network of channel partners in 40+ countries.
Name: ANSYS Products
Version: (64bit) 17.1.0 (repack)
OS: ShiChuang 7even / 8.1 / 10
Size: 7.6 Gb